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Optimizing the Sintering Process of Diamond Segments: Enhancing Bond Strength and Cutting Efficiency

May 31, 2024

In the process of sintering diamond segments, using metal powders that do not chemically react with diamond at high temperatures certainly does not damage the diamond. However, the diamond is held in place by the matrix during cutting. If the matrix powder does not react with the diamond, its holding power is purely mechanical embedding. This mechanical embedding force is relatively weak, which can lead to the diamond detaching from the blade during use, thereby reducing the blade's lifespan and efficiency. If the matrix powder has a certain degree of reaction with the diamond, forming chemical bonds between the diamond and the metal powder, this bonding force is much stronger than mechanical embedding. This ensures that the diamond does not fall off during use, enhancing the matrix's holding power on the diamond, and also improving the blade's lifespan and efficiency.

However, if the metal powder used in the binder reacts strongly with the diamond at high temperatures, it will cause the diamond to carbonize and reduce its strength, thus lowering the blade's lifespan and efficiency. Analysis shows that above 900℃, if there is iron in the matrix, diamond begins to infiltrate the iron as carbon, causing surface erosion of the diamond. When the temperature continues to rise to 1200℃, the diamond can even completely infiltrate the iron. Therefore, it is essential to control the reaction speed between the metal powder and the diamond so that they form chemical bonds without causing excessive carbonization of the diamond, affecting its strength. To control the extent of the reaction between the diamond and the metal powder, other chemical elements can also be added to the matrix.

So, which elements can increase the holding power of the diamond matrix? Mainly some rare metals, such as titanium, which is an excellent metal for enhancing the holding power of the diamond. It is often used in the production of diamond segments. After the diamond segments are sintered, they are held under pressure and cooled to around 600℃ before being removed from the hot press. Then, they can be further cooled to room temperature with a fan, at which point the segments can be taken out.